Chips Packaging Gorash Simple M 1 3Dモデル

This simple 3D model 'Chips Packaging Gorash Simple M 1' specially for your projects.
The model quality and accuracy allows you to use it in any projects. 3D model with the correct topology, accurate UVW mapping and high-resolution textures make the model realistic, allowing you to use a model in high-resolution renderers (close-up), as well as for creating videos, or video advertising or use in the film industry.
The model is created in Autodesk 3ds Max 2020, rendered with V-Ray Next 4.2
Please don't forget to rate the model, for us it is very important

3D model available in these formats:
- 3ds Max 2020 (max) V-Ray Next 4.2
- 3ds Max 2015 (max) V-Ray 3.6
- 3ds Max 2010 (max) V-Ray 2.2
- Autodesk FBX 2020 (fbx)
- Autodesk FBX 2015 (fbx)
- Autodesk FBX 2006 (fbx)
- Wavefront OBJ (obj)
- Stereolithography STL (stl)

Geometry:
- Subdivision ON:
- Polygons: 3 232
- Triangles: 6 464
- Edges: 6 464
- Vertices: 3 234

- Subdivision OFF:
- Polygons: 202
- Triangles: 404
- Edges: 404
- Vertices: 204

Scene details:
- Scale of all details (100,100,100)
- Model has real-world scale and is centered at X: 0, Y: 0
- Materials, objects and textures have the correct names
- No cleaning up necessary, just drop your models into the scene and start rendering
- Model is intended for subdivision

Textures are included:
- Chips_Packaging_Gorash_Simple_M_1_Diffuse_00.png (4096x2560)
- Chips_Packaging_Gorash_Simple_M_1_Normal_00.png (4096x2560)

Please don't forget to rate the model, for us it is very important

© Leonid Naku [Zurel] 2023 印刷　準備: いいえ